Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...
Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Ansys lessens barriers to entry, empowers students to enhance electronics-specific simulation skillset and spurs the next generation of innovation Free download expands students’ online access to ...
Ansys Inc. (Pittsburgh, Pa., U.S.) has announced that simulation product Ansys 2025 R2 features new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 ...
January 29, 2014. ANSYS at DesignCon debuted new functionality for ANSYS SIwave. ANSYS’ electromagnetic (EM) simulation suite for the design of high-speed printed circuit boards (PCB) and integrated ...
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