Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...

With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...

TT Electronics, a global provider of engineered electronics for performance critical applications, has launched the QSOP-C and SOIC-C high-density resistor networks that combine high precision with ...

Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...

Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, ...

With a thorough understanding of the differing design considerations, roller screw-based electromechanical actuators can replace hydraulic cylinders in high power-density applications with ...