Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...

The Union Cabinet on Thursday approved Rs 1.26 trillion worth of investments in three semiconductor plants, including a Tata group proposal to build the country’s first major chip fabrication facility ...

On Jan. 15, 2026, the global technology landscape witnessed a strategic pivot with the United States and Taiwan having finalized a historic trade agreement to jointly build chips and chip factories on ...

Chip makers jolted markets higher in a burst of preholiday trading, yanking the 500 back from an early wobble and turning a ...