Enhanced Reliability: Bringing the via fill process in-house at the Oregon plant ensures total quality control over boards requiring flat surfaces for component mounting (via-in-pad). This provides ...

Over the past two decades, photonic integrated circuits made from silicon have quickly moved from just being studied in academic settings to being widely used in data centres and telecommunication ...

Forming circuits involves the use of cylindrical pieces of semiconductor material. These cylinders are sliced into thin, circular pieces known as bare wafers. The bare wafers are then oxidized before ...

Partnership through USC Information Sciences Institute's MOSIS Service will offer multi-project-wafer runs for microelectronics by combining MOSIS Service integrated circuits manufacturing services ...