Semiconductor Engineering

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...
AZOM

Integration of Two-Dimensional Materials on Silicon Microchips

The semiconductors industry is expected to be revolutionized by two-dimensional materials. Still, while multiple studies have noted prototype devices comprising hopeful properties for driving and ...
New Electronics

CEA-Leti achieves low-temperature CMOS breakthrough for 3D chip integration

CEA-Leti has announced a major advance in semiconductor manufacturing, successfully fabricating fully functional 2.5 V SOI ...
Semiconductor Engineering

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration

New research paper titled “Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)” from researchers at Tokyo ...