US & Canada, March 24, 2025 (GLOBE NEWSWIRE) -- According to a new comprehensive report from The Insight Partners, "Substrate-Like PCB Market Size and Forecast (2021 - 2031), Global and Regional Share ...

Copper surge squeezes Korea PCB profits, firms pivot toward glass substrates Korean pcb makers face margin squeeze from copper rally, accelerating shift to glass substrates ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

Continued pressure for electronic devices that provide greater functionality in ever-smaller form-factors is not only providing the driving force behind developing smaller surface-mount components and ...

Dublin, May 15, 2025 (GLOBE NEWSWIRE) -- The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron and Kinsus, ...

LONDON--(BUSINESS WIRE)--According to the latest market research report released by Technavio, the global substrate-like PCB market is expected to accelerate at a CAGR of over 7% during the forecast ...

"Until about 10 years ago, standardized semiconductors were used, but now, as customized products have increased, packaging is also increasingly demanded to be customized. In the process of developing ...

Looking at the overall condition of the Printed Circuit Board (PCB) market in 2023, efforts to reallocate and adjust the electronics supply chain are palpable amidst the decline in demand for consumer ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.