Researchers from the Florida Institute for Cybersecurity (FICS) at the University of Florida published this technical paper titled “FICS PCB X-ray: A dataset for automated printed circuit board ...
In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...
The industrial radiography is used to identify whether there are internal or external discontinuities in industrial components. In this way, it is possible to analyze in depth whether a part is in ...
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