Printed Circuit Boards (PCBs) are a fundamental part of the majority of electronics systems. They are primarily designed to mechanically support and electrically connect electronic components, and are ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...

I came across an article on PCB layout in Electronic Design magazine. It’s a pretty good article and I am glad to see the trade magazines realize we care as much about PCB layout as the bus-caching ...

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...

Pulsonix, the industry-leading PCB design software from WestDev Ltd, has announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal ...

Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...

As electronic content in vehicles continues to rise, designers must find solutions for reliability under intense heat, advises Daren McClearnon. Heat kills semiconductors and automotive environments ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Thanks to MSC Software you can now download a free thermal simulation tool, PICLS Lite, via the Electronics Weekly website. It could represent a saving of hundreds of pounds, and means anyone can ...

Fig 1. The die pad in Texas Instruments’ PowerPAD supports the die during fabrication, thus serving as a good thermal heat path to remove the heat away from the chip. Fig 2. TI’s PowerStack 3D ...