Xiaomi today announced the launch of REDMI Note 15 Series, comprising three models — REDMI Note 15 Pro+ 5G, REDMI Note 15 Pro ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

PROCESS Worldwide brings to you the ‘Top 10 plant engineering projects of January 2026’ from all over the world. Right from BASF starting up its steam cracker at the Verbund site in China to Wood ...

Denis Mandich, CTO of Qrypt, a quantum cybersecurity company, and founding member of the Quantum Economic Development ...

BITS Pilani has collaborated with Siemens to launch joint certification program in PCB Design and Analysis.

If you've browsed new motherboards, you might have noticed that some of them come with two Ethernet ports. Redundancy is the name of the game.

AI servers are pushing data centers to their limits. This guide reveals how smarter power design can cut losses & solve ...

The talks in Oman tomorrow are seen as a last-ditch diplomatic effort to prevent another conflict in the tumultuous Middle East.

What if AI could deliver the accuracy of digital computing while using only a fraction of the power? How close are we to a ...

According to Towards Packaging consultants, the global paper-based barrier market is projected to reach approximately USD ...

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